Firmly established in the smartphone arena thanks to providing processing platforms for a multitude of Android and Windows devices, mobile chipmaker Qualcomm has this week said significant performance improvements are in the offing through its upcoming third-generation technology.
The first Qualcomm product to emerge through 28nm manufacturing and bolstered by an upgraded CPU core, the new MSM 8960 dual-core chipset will apparently deliver five times the performance of the company’s first Snapdragon chip while sucking up 75 percent less power.
Designed to further Qualcomm’s placement within the mobile market, the MSM 8960 also benefits from improved graphics capabilities (up to four times more than the first Snapdragon), along with an integrated multi-modem capable of hosting new LTE (Long Term Evolution) technology as well as existing 3G networks.
According to previous snippets of information regarding Qualcomm’s third-gen processors, other contributing aspects will include dual application cores (up to 1.2GHz), support for HSPA+ and multi-mode HSPA+, 1x EV-DO Rev B, and integrated connectivity for WLAN, GPS and Bluetooth.
In terms of quantifying the company’s industry positioning both now and in the future, Qualcomm has said some 55 mobile devices presently operate via its Snapdragon platform, and around 125 more are currently being readied for market.